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基于参数化仿真方法，对比金锡焊料熔封过程中，焊料的不同夹持位置对金锡焊料的应力分布影响。为了简化仿真过程、节省模型载荷施加时间，采用基于ABAQUS Python的二次开发程序，实现弹簧夹子压力载荷的参数化施加和仿真结果的参数化提取，进一步提高仿真效率。在参数化建模和结果批量导出的基础上，发现金锡焊料在熔封过程中的应力分布不均匀，在弹簧夹子直接施加压力的区域，应力较大，是造成焊料向芯腔内溢的重要原因；在远离弹簧夹子施加压力的区域，应力较小，趋近于零，是造成焊料空洞的重要原因。基于参数化仿真结果，当弹簧夹子夹持位置从边缘向中间移动，应力差值从0.725 MPa增加至0.772 MPa,导致应力分布更加不均匀，通过金锡焊料熔封实验，验证了弹簧夹子在边角处时，焊接空洞和内溢最少，焊接可靠性最高。
Abstract：Based on a parameterized simulation method, the influences of different clamping positions of solder on the stress distribution of Au80Sn20 solder during the Au80Sn20 solder fusion sealing process were compared. In order to simplify the simulation process and save model load application time, the parameterized application of spring clip pressure load and parameterized extraction of simulation results were achieved by a secondary development program based on ABAQUS Python, further improving simulation efficiency. On the basis of parametric modeling and batch export of results, it is found that the stress distribution of Au80Sn20 solder during the fusion sealing process is uneven. In the area where the spring clip directly applies pressure, the stress is relatively high, which is an important reason for the solder to internal overflow into the core cavity. In the area away from the spring clip where pressure is applied, the stress is relatively low and approaches zero, which is an important cause of solder voids. Based on the results of parameterized simulation, when the clamping position of the spring clamp is moved from the edge to the middle, the stress difference value increases from 0.725 MPa to 0.772 MPa, resulting in a more uneven stress distribution. Through the Au80Sn20 solder fusion sealing experiment, it verifies that the welding void and internal overflow are the least and the welding reliability is the highest when the spring clamp is at the corner.
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基本信息:
DOI：10.13250/j.cnki.wndz.25080501
中图分类号:TN405;TB114.3
引用信息:
[1]程理丽.基于参数化仿真的金锡焊料熔封可靠性分析[J].微纳电子技术,2025,62(08):118-126.DOI:10.13250/j.cnki.wndz.25080501.
2025-08-14
2025-08-14