微纳电子技术

为探究光电耦合器内封装结构对器件性能的影响，对光电耦合器内封装结构进行有限元仿真研究。在相同的外封装尺寸和结构下，通过热传导模型仿真三种不同内封装结构的结温、热应力、热应变。通过分析目前两种经典输出端载片台结构设计存在的缺陷，提出倒凸型优化结构。该内封装结构能够有效增大散热面积，从而改善光电耦合器内部芯片与引线框架之间封装分层的问题，满足新能源汽车行业对器件耐高压性能的要求。对优化后的光电耦合器制备小批量试样并进行测试，之后比较了三种结构的电流传输比(CTR)及输入输出间的绝缘电压。实验结果与仿真结果相一致，证实了采用倒凸型优化结构能够有效提高绝缘电压和CTR动态范围。

In order to explore the effect of the internal package structure of the optocoupler on the device performance, the finite element simulation of the internal package structure of the optocoupler was carried out. Under the same external package size and structure, the junction temperature, thermal stress and thermal strain of three different internal package structures were simulated by heat conduction model. By analyzing the defects existing in the two classical designs of the output-end loader table structures, the convex optimization structure was proposed. The internal package structure can effectively increase the heat dissipation area, thereby improving the problem of packaging delamination between the internal chip and the lead frame of the optocoupler, and meeting the requirements of the new energy automobile industry for the high-voltage resistance performance of the device. A small amount samples of the optimized optocoupler was prepared and tested. And the current transfer ratio(CTR) and insulation voltage between input and output were compared among three structures. The experimental results are in agreement with the simulation results. It is proved that the dynamic range of insulation voltage and CTR can be effectively improved by using the convex optimization structure.