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传统微电子加工工艺存在着诸多限制,尤其是无法实现具有复杂三维(3D)结构的微电子器件的加工。首先,简述3D打印的工艺流程,并详细介绍了用于微电子器件制造的三种典型3D打印技术。随后,从刚性电子器件、柔性电子器件和半导体器件角度出发,重点阐述了3D打印技术在微电子器件制造中的研究现状。最后,总结了3D打印技术在制造微电子器件中存在的主要问题,并讨论了基于3D打印技术的微电子器件制造的未来发展方向。未来微电子器件的加工将会向着体积小、重量轻、可靠性高和工作速度快等方向发展,可任意形状成型的3D打印技术的迅速崛起可为研究人员提供更多的思路,可推动交通运输、邮电通信、生物医疗、文化教育以及消费类电子产品等众多领域的发展。
Abstract：Traditional microelectronic processing technology has many limitations.In particular,the processing of microelectronic devices with complex three-dimensional(3 D)structures cannot be realized.Firstly,the technological process of the 3 D printing is briefly described,and three kinds of typical 3 D printing technologies for the fabrication of microelectronic devices are introduced in detail.Then,from the perspectives of rigid electronic devices,flexible electronic devices and semiconductor devices,the research status of the 3 D printing technology in the manufacturing of microelectronic devices is emphatically expounded.Finally,the main problems of the 3 D printing technology in the manufacturing of microelectronic devices are summarized,and the future development direction of the manufacturing of microelectronic devices based on the 3 D printing technology is discussed.In the future,the processing of microelectronic devices will develop towards the directions of small size,light weight,high reliability and fast working speed,etc.The rapid rise of the 3 D printing technology that can obtain any shape will provide more ideas for researchers and promote the development of transportation,post and telecommunications,biological medicine,culture and education,consumer electronics and other fields.
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基本信息:
DOI：10.13250/j.cnki.wndz.2019.10.012
中图分类号:TN405;TP391.73
引用信息:
[1]樊宁,唐文来,杨继全.基于3D打印技术的微电子器件制造[J].微纳电子技术,2019,56(10):844-851.DOI:10.13250/j.cnki.wndz.2019.10.012.
基金信息:
国家自然科学基金资助项目(51805272);; 江苏省重点研发计划资助项目(BE2018010-1,BE2018010-2);; 江苏省高等学校自然科学研究基金资助项目(18KJB460022)
2019-09-23
2019-09-23