微纳电子技术

集成电路在后摩尔时代的发展呈现出多模式创新的特点。综述了后摩尔时代中一大创新发展热点，即chiplet基3D集成技术与集成微系统的最新进展。综述并分析了当今chiplet基3D集成技术的关键技术的发展现状与趋势，包含3D集成技术、chiplet之间的宽带互连、布局布线与时钟同步、热管理、计算机辅助设计(CAD)等方面的创新。并展现了基于这些关键技术的突破，集成微系统的新进展，包含高性能计算多核处理器、神经网络计算处理器、神经网络加速器、射频微系统和光电微系统的创新。集成微系统已进入智能微系统新发展阶段。

The development of integrated circuit in the post-Moore era presents the characteristics of multi-mode innovation. One of the major innovation development hotspots in the post-Moore era is reviewed, i.e. the recent progress of chiplet-based 3D integration technology and integrated microsystems. The current development status and trends of the key technologies of chiplet-based 3D integration technology are reviewed and analyzed, including the innovations in 3D integration technology, broadband interconnection between chiplets, layout and clock synchronization, thermal management, computer-aided design(CAD) and so on. Based on the breakthrough of these key technologies, the new progress of integrated microsystems is presented, including the innovations of high-performance computing multi-core processors, neural network computing processors, neural network accelerators, radio frequency microsystems and photoelectric microsystems. Integrated microsystems have entered the new development stage of intelligent microsystems.