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2025, 04, v.62 55-75
玻璃通孔成型工艺及应用的研究进展
基金项目(Foundation): 国家自然科学基金重点项目(62335014); 国家科技部“十四五”重点研发计划(2023YFC2413001); 上海市科技创新行动计划(22501100800); 上海交通大学决策咨询重点课题实验技术专项(JCZXSJA2023-05)
邮箱(Email):
DOI: 10.13250/j.cnki.wndz.25040103
投稿时间: 2024-10-25
投稿日期(年): 2024
修回时间: 2024-11-15
终审时间: 2024-11-15
终审日期(年): 2024
审稿周期(年): 1
发布时间: 2025-02-27
出版时间: 2025-02-27
网络发布时间: 2025-02-27
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摘要:

随着摩尔定律逐渐逼近其物理极限,传统封装技术已经不能满足智能化时代对芯片的轻量化和高集成化的需求。三维堆叠封装通过多层堆叠和立体互连实现了芯片和器件的高性能集成。其中通孔结构在三维集成封装中发挥着极为关键的作用。由于玻璃材料具有优异的电学性能、机械和化学稳定性,玻璃通孔(TGV)技术被认为是下一代三维集成的关键技术。系统性地回顾了TGV成型工艺的研究进展,对比了不同TGV成型工艺的优缺点,总结了TGV的主要应用,讨论了TGV当前的发展情况及面临的挑战。

Abstract:

As Moore's law approaches its physical limit, the traditional packaging technology has been unable to meet the needs of lightweight and high integration of chips in the era of intelligence. 3D stacked packaging enables high performance integration of chips and devices through multilayer stacking and vertical interconnection. Among them, through via plays an extremely key role in 3D integrated packaging. Due to the excellent electrical properties, mechanical and chemical stabilities of glass, through glass via(TGV) is considered as a key technology for the next generation of 3D integration. This paper systematically reviews the research progresses of TGV forming process, compares the advantages and disadvantages of different TGV forming processes, summarizes the main applications of TGV, and discusses the current development and challenges of TGV.

参考文献

[1] SHOREY A,POLLARD S,STRELTSOV A,et al.Deve-lopment of substrates for through glass vias (TGV) for 3DS-IC integration [C]//Proceedings of IEEE 62nd Electronic Components and Technology Conference.San Diego,USA,2012:1-3.

[2] SALAH K.TGV versus TSV:a comparative analysis [C]//Proceedings of the 3rd International Conference on Advances in Computational Tools for Engineering Applications (ACTEA).Zouk Mosbeh,Lebanon,2016:1-5.

[3] SUN X F,SUN Y,ZHANG J,et al.Design of RF MEMS phase shifter packaging based on through glass via (TGV) interposer[C]//Proceedings of the 13th International Con-ference on Electronic Packaging Technology & High Density Packaging.Guilin,China,2012:808-810.

[4] KIM J,SHENOY R,LAI K Y,et al.High-Q 3D RF solenoid inductors in glass [C]//Proceedings of IEEE Radio Frequency Integrated Circuits Symposium.Tampa,USA,2014:199-200.

[5] LUECK M,HUFFMAN A,SHOREY A.Through glass vias (TGV) and aspects of reliability [C]//Proceedings of IEEE 65th Electronic Components and Technology Conference (ECTC).San Diego,USA,2015:1-6.

[6] SHOREY A B,KURAMOCHI S,YUN C H.Through glass via (TGV) technology for RF applications [J].International Symposium on Microelectronics,2015 (1):000386-000389.

[7] GHOBEITY A,GETU H,PAPINI M,et al.Surface evolution models for abrasive jet micromachining of holes in glass and polymethylmethacrylate (PMMA) [J].Journal of Micromechanics and Microengineering,2007,17(11):2175-2185.

[8] INOUE T,OHTAKI K,ADACHI J,et al.Direct synthesis of hydrogen peroxide using glass fabricated microreactor-multichannel operation and catalyst comparison [J].Catalysis Today,2015,248:169-176.

[9] WENSINK H,BERENSCHOT J W,JANSEN H V,et al.High resolution powder blast micromachining [C]//Proceedings of Proceedings IEEE Thirteenth Annual Internatio-nal Conference on Micro Electro Mechanical Systems.Miyazaki,Japan,2000:769-774.

[10] HOF L,ABOU ZIKI J.Micro-hole drilling on glass substrates—a review [J].Micromachines,2017,8(2):53.

[11] YANG Z,WANG Y,WANG H,et al.High-g MEMS shock threshold sensor integrated on a copper filling through-glass-via (TGV) substrate for surface mount application [C]//Proceedings of Transducers-2015 18th International Conference on Solid-State Sensors,Actuators and Microsystems (TRANSDUCERS).Anchorage,USA,2015:291-294.

[12] CAI H,YAN J,MA S L,et al.Design,fabrication,and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration [J].Journal of Micromechanics and Microengineering,2019,29(7):075002.

[13] YAN J,MA S L,MA F L,et al.Process development of through-glass-via (TGV) interposer for radio frequency (RF) applications [C]//Proceedings of IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).Chengdu,China,2016:1-4.

[14] KUMAR J.Ultrasonic machining—a comprehensive review [J].Machining Science and Technology,2013,17(3):325-379.

[15] CONG W L,PEI Z J.Process of ultrasonic machining [M]//Handbook of Manufacturing Engineering and Technology.London:Springer London,2014:1629-1650.

[16] ILIESCU C,CHEN B T,MIAO J M.On the wet etching of Pyrex glass [J].Sensors and Actuators:A,2008,143(1):154-161.

[17] 张锦文,杨化冰,蒋巍,等.Pyrex7740 玻璃通孔湿法腐蚀技术研究 [J].功能材料与器件学报,2011,17(6):596-599.ZHANG J W,YANG H B,JIANG W,et al.Fabrication of via-hole on Pyrex7740 glass wafer by HF wet-etching technique[J].Journal of Functional Materials and Devices,2011,17(6):596-599(in Chinese).

[18] ICHIKI T,SUGIYAMA Y,UJIIE T,et al.Deep dry etching of borosilicate glass using fluorine-based high-density plasmas for microelectromechanical system fabrication [J].Journal of Vacuum Science & Technology:B,2003,21(5):2188-2192.

[19] LI X,ABE T,LIU Y,et al.Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass [J].Journal of Microelectromechanical Systems,2002,11(6):625-630.

[20] TANG Y H,LIN Y H,SHIAO M H,et al.Development of thin quartz glass utilising through-glass-via (TGV) formation by dry etching technology [J].Micro & Nano Letters,2016,11(10):568-571.

[21] KOLARI K.Deep plasma etching of glass with a silicon shadow mask [J].Sensors and Actuators:A,2008,141(2):677-684.

[22] MISHRA D K,VERMA A K,ARAB J,et al.Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining [J].Journal of Micromechanics and Microengineering,2019,29(7):075004.

[23] TAKAHASHI S,TATSUKOSHI K,ONO M,et al.TGV technology for Glass interposer [C]//Proceedings of the 4th Electronic System-Integration Technology Confe-rence.Amsterdam,Netherlands,2012:1-3.

[24] TAKAHASHI S,HORIUCHI K,TATSUKOSHI K,et al.Development of through glass via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging [C]//Proceedings of IEEE 63rd Electronic Components and Technology Conference.Las Vegas,USA,2013:348-352.

[25] KANT BAJPAI V,KUMAR MISHRA D,DIXIT P.Fabrication of through-glass vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications [J].Applied Surface Science,2022,584:152494.

[26] KANNOJIA H K,ARAB J,PEGU B J,et al.Fabrication and characterization of through-glass vias by the ECDM process [J].Journal of the Electrochemical Society,2019,166(13):D531-D538.

[27] SUKUMARAN V,CHEN Q,LIU F H,et al.Through-package-via formation and metallization of glass interposers [C]//Proceedings of the 60th Electronic Components and Technology Conference (ECTC).Las Vegas,USA,2010:557-563.

[28] BRUSBERG L,QUEISSER M,GENTSCH C,et al.Advances in CO2-laser drilling of glass substrates [J].Physics Procedia,2012,39:548-555.

[29] CHUNG C K,LIN S L,WANG H Y,et al.Fabrication and simulation of glass micromachining using CO2 laser processing with PDMS protection [J].Applied Physics:A,2013,113(2):501-507.

[30] KATSURA T,NAKAMURA R,KOJIMA T,et al.Micro processing in glass substrates with pulsed CO2 lasers [C]//Proceedings of the 9th International Microsystems,Packaging,Assembly and Circuits Technology(IMPACT).Taipei,China,2014:329-330.

[31] SUKUMARAN V,KUMAR G,RAMACHANDRAN K,et al.Design,fabrication,and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon [J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2014,4(5):786-795.

[32] KEIPER B,EXNER H,L?SCHNER U,et al.Drilling of glass by excimer laser mask projection technique [C]//Proceedings of International Congress on Applications of Lasers & Electro-Optics.San Diego,USA,1999:1-8.

[33] WLODARCZYK K L,BRUNTON A,RUMSBY P,et al.Picosecond laser cutting and drilling of thin flex glass [J].Optics and Lasers in Engineering,2016,78:64-74.

[34] SATO Y,IMAJYO N,ISHIKAWA K,et al.Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass [J].Journal of Materials Science:Materials in Electronics,2019,30(11):10183-10190.

[35] STILLMAN J,JUDY J,HELVAJIAN H.Aspect ratios,sizes,and etch rates in photostructurable glass-ceramic [C]//Proceedings of Micromachining and Microfabrication Process Technology XIII.San Jose,USA,2008:1-11.

[36] LIVINGSTON F E,HANSEN W W,HUANG A,et al.Effect of laser parameters on the exposure and selective etch rate in photostructurable glass [C]//Proceedings of Photon Processing in Microelectronics and Photonics.San Jose,USA,2002:404-412.

[37] LIVINGSTON F E,HELVAJIAN H.Selective activation of material property changes in photostructurable glass ceramic materials by laser photophysical excitation [J].Journal of Photochemistry and Photobiology:A,2006,182(3):310-318.

[38] 梁天鹏.低损耗可光刻玻璃及通孔技术研究 [D].成都:电子科技大学,2021.

[39] ZHAO X D,PI Y D,WANG W,et al.High aspect ratio TGV fabrication using photosensitive glass substrate [C]//Proceedings of the 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).Qingdao,China,2018:1-3.

[40] HU B,YUAN B P,YU T L,et al.Effect of SiO2/Li2O content on structure and physicochemical properties of photosensitive glass-ceramics [J].Ceramics International,2024,50(7):10000-10006.

[41] 张浩,朱永昌,崔竹,等.锂铝硅系光敏微晶玻璃的研究进展和应用 [J].材料导报,2018,32(S2):80-84.ZHANG H,ZHU Y C,CUI Z,et al.Research progress and applications of photosensitive glass-ceramics of Li2O-Al2O3-SiO2 system [J].Materials Reports,2018,32(S2):80-84 (in Chinese).

[42] CHEN L,ZHANG J H,CHEN H W,et al.Enhanced mechanical properties of Li2O-Al2O3-SiO2 photostructurable glass by SrO doping [J].Journal of Electronic Materials,2020,49(1):705-711.

[43] ZHAO H L,ZHANG J H,CHEN H W,et al.The effects of La2O3 doping on the photosensitivity,crystallization behavior and dielectric properties of Li2O-Al2O3-SiO2 photostructurable glass [J].Ceramics International,2018,44(17):20821-20826.

[44] SHAN Z T,LI C J,TAO H Z.Mixed alkaline-earth effect on the mechanical and rheological properties of Ca-Mg silicate glasses [J].Journal of the American Ceramic Society,2017,100(10):4570-4580.

[45] LIANG T P,ZHANG J H,CHEN H W,et al.Effect of Al2O3 on structural dynamics and dielectric properties of lithium metasilicate photoetchable glasses as an interposer technology for microwave integrated circuits [J].Ceramics International,2020,46(11):18032-18036.

[46] LIANG T P,ZHANG J H,CHEN H W,et al.Effect of B-doping,UV exposure and thermal annealing on dielectric properties and crystallization behavior of Li-Al-Si photoetchable glasses [J].Ceramics International,2020,46(18):28108-28113.

[47] JUODKAZIS S,MISAWA H,HASHIMOTO T,et al.Laser-induced microexplosion confined in a bulk of silica:formation of nanovoids [J].Applied Physics Letters,2006,88(20):201909.

[48] BELLOUARD Y,SAID A,DUGAN M,et al.Fabrication of high-aspect ratio,micro-fluidic channels and tunnels using femtosecond laser pulses and chemical etching [J].Optics Express,2004,12(10):2120-2129.

[49] RAJESH S,BELLOUARD Y.Towards fast femtosecond laser micromachining of fused silica:the effect of deposited energy [J].Optics Express,2010,18(20):21490-21497.

[50] KIM S,KIM J,JOUNG Y H,et al.Optimization of selective laser-induced etching (SLE) for fabrication of 3D glass microfluidic device with multi-layer micro channels [J].Micro and Nano Systems Letters,2019,7(1):15.

[51] HERMANS M,GOTTMANN J,RIEDEL F.Selective,laser-induced etching of fused silica at high scan-speeds using KOH [J].Journal of Laser Micro/Nanoengineering,2014,9(2) :126-131.

[52] KIM J,KIM S,KIM B,et al.Study of through glass via (TGV) using Bessel beam,ultrashort two-pulses of laser and selective chemical etching [J].Micromachines,2023,14(9):1766.

[53] OSTHOLT R,AMBROSIUS N,KRUGER R A.High speed through glass via manufacturing technology for interposer [C]//Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).Helsinki,Finland,2014:1-3.

[54] CHEN L,YU D Q.Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching [J].Journal of Materials Science:Materials in Electronics,2021,32(12):16481-16493.

[55] QI J,WANG Z H,XU J,et al.Femtosecond laser induced selective etching in fused silica:optimization of the inscription conditions with a high-repetition-rate laser source [J].Optics Express,2018,26(23):29669-29678.

[56] SANTOS R,AMBROSIUS N,OSTHOLT R,et al.Bringing new life to glass for wafer-level packaging applications [C]//Proceedings of International Wafer Level Packaging Conference (IWLPC).San Jose,USA,2020:1-7.

[57] SANTOS R,DELRUE J P,AMBROSIUS N,et al.Processing glass substrate for advanced packaging using laser induced deep etching [C]//Proceedings of IEEE 70th Electronic Components and Technology Conference (ECTC).Orlando,USA,2020:1922-1927.

[58] CARIAS V,THOMPSON J,MYERS P D,et al.Development of mold compounds with ultralow coefficient of thermal expansion and high glass transition temperature for fanout wafer-level packaging [J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2015,5(7):921-929.

[59] LEE T C,CHANG Y S,HSU C M,et al.Glass based 3D-IPD integrated RF ASIC in WLCSP [C]//Proceedings of IEEE 67th Electronic Components and Technology Confe-rence (ECTC).Orlando,USA,2017:631-636.

[60] WOEHRMANN M,BRAUN T,TOEPPER M,et al.Ultra-thin 50 μm fan-out wafer level package:development of an innovative assembly and de-bonding concept [C]//Proceedings of IEEE 68th Electronic Components and Technology Conference (ECTC).San Diego,USA,2018:675-681.

[61] SHI T L,BUCH C,SMET V,et al.First demonstration of panel glass fan-out (GFO) packages for high I/O density and high frequency multi-chip integration [C]//Procee-dings of IEEE 67th Electronic Components and Technology Conference (ECTC).Orlando,USA,2017:41-46.

[62] SHI T L,GONG Y Y,RAVICHANDRAN S,et al.Next generation of automotive radar with leading-edge advances in SiGe devices and glass panel embedding (GPE) [C]//Proceedings of IEEE 68th Electronic Components and Technology Conference (ECTC).San Diego,USA,2018:1245-1250.

[63] YU T,CHEN C,JIANG F,et al.Process,design and simulation for millimeter wave chip packaging using embedded glass fan-out technology [C]//Proceedings of the 20th International Conference on Electronic Packaging Technology(ICEPT).Hong Kong,China,2019:1-4.

[64] YU T,ZHANG X D,CHEN L,et al.Development of embedded glass wafer fan-out package with 2D antenna arrays for 77 GHz millimeter-wave chip [C]//Proceedings of IEEE 70th Electronic Components and Technology Confe-rence (ECTC).Orlando,USA,2020:31-36.

[65] SUKUMARAN V,BANDYOPADHYAY T,SUNDARAM V,et al.Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs [J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2012,2(9):1426-1433.

[66] el BOUAYADI O,LAMY Y,DUSSOPT L,et al.3D integration and packaging of mm wave circuits and antennas:opportunities and challenges [J].Microwave Journal,2016,59(2):1-4.

[67] KAMGAING T,ELSHERBINI A A,FRANK T W,et al.Investigation of a photodefinable glass substrate for millimeter-wave radios on package [C]//Proceedings of IEEE 64th Electronic Components and Technology Conference (ECTC).Orlando,USA,2014:1610-1615.

[68] HWANGBO S,SHOREY A B,YOON Y K.Millimeter-wave wireless intra-/ inter chip communications in 3D integrated circuits using through glass via (TGV) disc-loaded patch antennas [C]//Proceedings of IEEE 66th Electronic Components and Technology Conference (ECTC).Las Vegas,USA,2016:2507-2512.

[69] HWANGBO S,FANG S P,AN H,et al.Directional through glass via (TGV) antennas for wireless point-to-point interconnects in 3D integration and packaging [C]//Proceedings of IEEE 67th Electronic Components and Technology Conference (ECTC).Orlando,USA,2017:260-265.

[70] ZHANG G T,CHEN H J,YANG Y,et al.A differentially fed dual-polarized antenna-in-package based on stacked TGV interposers for 5G application [C]//Proceedings of International Conference on Electronics Packaging (ICEP).Sapporo,Japan,2022:115-116.

[71] SU Y Q,YU D Q,RUAN W B,et al.Development of compact millimeter-wave antenna by stacking of five glass wafers with through glass vias [J].IEEE Electron Device Letters,2022,43(6):934-937.

[72] ONOHARA J,TAKAGI F,KIZU T,et al.Development of the integrated passive device using through-glass-via substrate [C]//Proceedings of International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).Mie,Japan,2018:19-22.

[73] KIM M S,PULUGURTHA M R,SUNDARAM V,et al.Ultrathin high-Q 2-D and 3-D RF inductors in glass packages [J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2018 ,8(4):643-652.

[74] CALVEZ C,PERSON C,COUPEZ J P,et al.New millimeter wave packaged antenna array on IPD technology [C]//Proceedings of Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).New Orleans,USA,2010:96-99.

[75] CHEN C H,SHIH C S,HORNG T S,et al.Very miniature dual-band and dual-mode bandpass filter designs on an integrated passive device chip [J].Progress in Electromagnetics Research,2011,119:461-476.

[76] HSIEH S C,CHEN C H,CHANG Y S,et al.Fabrication challenge,device characterization of high-Q 2D,3D passives devices on glass [C]//Proceedings of IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).Honolulu,USA,2016:75-77.

[77] SU S M,WU S M,LAI C C,et al.Analysis and modeling of IPD for spiral inductor on glass substrate [C]//Procee-dings of International Conference on Microwave and Millimeter Wave Technology.Nanjing,China,2008:1-4.

[78] RAJ P M,JOW U M,DAI J X,et al.3D IPAC—a new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules [C]//Proceedings of IEEE 63rd Electronic Components and Technology Confe-rence.Las Vegas,USA,2013:517-522.

[79] YOOK J M,KIM D,KIM J C.High performance IPDs (integrated passive devices) and TGV (through glass via) interposer technology using the photosensitive glass [C]//Proceedings of IEEE 64th Electronic Components and Technology Conference (ECTC).Orlando,USA,2014:41-46.

[80] CHEN Y H,CHIEN C H,HSIEH Y C,et al.20″×20″ panel size glass IPD interposer manufacturing [C]//Proceedings of IEEE 66th Electronic Components and Technology Conference (ECTC).Las Vegas,USA,2016:2146-2150.

[81] ZHOU X F,MING X F,JI Y,et al.Fabrication of high Q factor integrated passive devices based on embedded fan-out wafer level package [C]//Proceedings of the 18th International Conference on Electronic Packaging Technology (ICEPT).Harbin,China,2017:601-604.

[82] REN X L,WEI J Y,YU D Q.Design and fabrication of high density 3D IPDs (integrated passive devices) on glass substrate [C]//Proceedings of IEEE International Confe-rence on Integrated Circuits,Technologies and Applications (ICTA).Nanjing,China,2020:127-129.

[83] ZHANG Z T,GU L,HU S W,et al.A compact chip filter for 5G communication frontend based on Glass IPD techno-logy [C]//Proceedings of the 22nd International Conference on Electronic Packaging Technology (ICEPT).Xiamen,China,2021:1-3.

[84] HAMED H,ELDIASTY M,SEYEDI-SAHEBARI S M,et al.Applications,materials,and fabrication of micro glass parts and devices:an overview [J].Materials Today,2023,66:194-220.

[85] HEDRICK B,SUKUMARAN V,FASANO B,et al.End-to-end integration of a multi-die glass interposer for system scaling applications [C]//Proceedings of IEEE 66th Electronic Components and Technology Conference (ECTC).Las Vegas,USA,2016:283-288.

[86] RAHIMI A,SENIOR D E,SHOREY A,et al.In-substrate resonators and bandpass filters with improved insertion loss in K-band utilizing low loss glass interposer technology and superlattice conductors [C]//Proceedings of IEEE 66th Electronic Components and Technology Confe-rence (ECTC).Las Vegas,USA,2016:1322-1328.

[87] WEI X C,WANG X J,YANG D C,et al.Design of compact and low-EMI waveguide structures based on through glass vias[C]// Proceedings of International Symposium on Electromagnetic Compatibility.Tokyo,Japan,2014.

[88] 卢茜,张剑,王文博,等.玻璃基三维集成技术在宽带射频领域的应用 [J].中国电子科学研究院学报,2021,16(5):434-437.LU Q,ZHANG J,WANG W B,et al.Application of the glass based 3D integration technology in broadband RF field [J].Journal of China Academy of Electronics and Information Technology,2021,16(5):434-437 (in Chinese).

[89] FANG Z,ZHANG J H,GAO L B,et al.Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs) [J].Frontiers of Information Technology & Electronic Engineering,2023,24(6):916-926.

[90] 沈湘,于杰平,王丽.光子芯片领域研究重点和发展趋势分析 [J].数据与计算发展前沿,2023,5(4):3-15.SHEN X,YU J P,WANG L.Research focus and research trend in photonic chip [J].Frontiers of Data & Computing,2023,5(4):3-15 (in Chinese).

[91] MILLER D A B.Device requirements for optical interconnects to silicon chips [J].Proceedings of the IEEE,2009,97(7):1166-1185.

[92] BRUSBERG L,SCHR?DER H,TOPPER M,et al.Thin glass based packaging technologies for optoelectronic modules [C]//Proceedings of the 59th Electronic Components and Technology Conference.San Diego,USA,2009:207-212.

[93] BRUSBERG L,SCHR?DER H,TOPPER M,et al.Photonic system-in-package technologies using thin glass substrates [C]//Proceedings of the 11th Electronics Packaging Technology Conference.Singapore,2009:930-935.

[94] BRUSBERG L,SCHR?DER H,ERXLEBEN R,et al.Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling [C]//Proceedings of the 60th Electronic Components and Technology Conference (ECTC).Las Vegas,USA,2010:269-274.

[95] SCHR?DER H,LEWOCZKO-ADAMCZYK W,WEBER D.Enabling photonic system integration by applying glass based microelectronic packaging approaches [J].EPJ Web of Conferences,2022,266:03020.

[96] SCHR?DER H,KIRSCH O,WEBER D,et al.Photonic system integration by applying microelectronic packaging approaches using glass substrates [C]//Proceedings of IEEE 73rd Electronic Components and Technology Confe-rence (ECTC).Orlando,USA,2023:216-223.

[97] SCHR?DER H,SCHWIETERING J,B?TTGER G,et al.Hybrid photonic system integration using thin glass platform technology [J].Journal of Optical Microsystems,2021,1(3):049801.

[98] CHOU B C,SATO Y,SUKUMARAN V,et al.Mode-ling,design,and fabrication of ultra-high bandwidth 3D glass photonics (3DGP) in glass interposers [C]//Procee-dings of IEEE 63rd Electronic Components and Technology Conference.Las Vegas,USA,2013:286-291.

[99] VIS W,CHOU B C,SUNDARAM V,et al.Self-aligned chip-to-chip optical interconnections in ultra-thin 3D glass interposers [C]//Proceedings of IEEE 65th Electronic Components and Technology Conference (ECTC).San Diego,USA,2015:804-809.

[100] CHOU B C,RAZDAN S,ZHANG H P,et al.Modeling,design,and demonstration of ultra-miniaturized and high efficiency 3D glass photonic modules [C]//Proceedings of IEEE 64th Electronic Components and Technology Confe-rence (ECTC).Orlando,USA,2014:1054-1059.

[101] BRUSBERG L,GRENIER J R,KOCABA? ? E,et al.Glass interposer for high-density photonic packaging [C]//Proceedings of Optical Fiber Communication Conference (OFC).San Diego,USA,2022:1-3.

[102] BRUSBERG L,GRENIER J R,ZAKHARIAN A R,et al.Glass platform for co-packaged optics [J].IEEE Journal of Selected Topics in Quantum Electronics,2023,29(3):6000210.

[103] BRUSBERG L,YEARY L,SEOK S H,et al.Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling [C]//Proceedings of Optical Interconnects XXIV.San Francisco,USA,2024:128920C.

[104] YU C,WU S C,ZHONG Y,et al.Application of through glass via (TGV) technology for sensors manufacturing and packaging [J].Sensors,2023,24(1):171.

[105] MIDDLEMISS R P,SAMARELLI A,PAUL D J,et al.Measurement of the earth tides with a MEMS gravimeter [J].Nature,2016,531(7596):614-617.

[106] ZWAHLEN P,NGUYEN A M,DONG Y F,et al.Navigation grade MEMS accelerometer [C]//Proceedings of IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS).Hong Kong,China,2010:631-634.

[107] PARK U,YOO K,KIM J.Development of a MEMS digital accelerometer (MDA) using a microscale liquid metal droplet in a microstructured photosensitive glass channel [J].Sensors and Actuators:A,2010,159(1):51-57.

[108] YOO K,LEE C,KIM J.A digital accelerometer using a microscale liquid-metal droplet in photosensitive glass channel [C]//Proceedings of TRANSDUCERS 2009 International Solid-State Sensors,Actuators and Microsystems Conference.Denver,USA,2009:676-679.

[109] FU Y C,HAN G W,GU J B,et al.A high-performance MEMS accelerometer with an improved TGV process of low cost [J].Micromachines,2022,13(7):1071.

[110] LEE M C,KANG S J,JUNG K D,et al.A high yield rate MEMS gyroscope with a packaged SiOG process [J].Journal of Micromechanics and Microengineering,2005,15(11):2003-2010.

[111] ZHAO Q C,YANG Z C,GUO Z Y,et al.Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes [J].Journal of Micro/Nanolithography MEMS and MOEMS,2011,10(1):011507.

[112] KUANG Y B,HOU Z Q,ZHUO M,et al.Research of wafer-level vacuum packaging based on TGV technology for MEMS devices [C]//Proceedings of IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).Vancouver,Canada,2020:988-991.

[113] EATON W P,SMITH J H.Micromachined pressure sensors:review and recent developments [J].Smart Mate-rials and Structures,1997,6(5):530-539.

[114] CHOA S H.Reliability of MEMS packaging:vacuum maintenance and packaging induced stress [J].Microsystem Technologies,2005,11(11):1187-1196.

[115] LUO Z Y,CHEN D Y,WANG J B,et al.A high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging [J].Sensors,2014,14(12):24244-24257.

[116] ADELEGAN O J,COUTANT Z A,ZHANG X,et al.Fabrication of 2D capacitive micromachined ultrasonic transducer (CMUT) arrays on insulating substrates with through-wafer interconnects using sacrificial release process [J].Journal of Microelectromechanical Systems,2020,29(4):553-561.

[117] ADELEGAN O J,COUTANT Z A,MINHAJ T I,et al.Fabrication of 32 × 32 2D capacitive micromachined ultrasonic transducer (CMUT) arrays on a borosilicate glass substrate with silicon-through-wafer interconnects using sacrificial release process [J].Journal of Microelectromechanical Systems,2021,30(6):968-979.

[118] ZHANG X,YAMANERY F Y,ORALKAN O.Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects [C]//Proceedings of IEEE International Ultrasonics Symposium (IUS).Taipei,China,2015:1-4.

[119] ZHANG X,YAMANER F Y,ORALKAN ?.Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducers with through-glass-via interconnects using anodic bonding [J].Journal of Microelectromechanical Systems,2017,26(1):226-234.

[120] LIU S,HU B K,LIU D W,et al.Micro-thermoelectric generators based on through glass pillars with high output voltage enabled by large temperature difference [J].Applied Energy,2018,225:600-610.

[121] SEGERINK L I,SPRENKELS A J,TER BRAAK P M,et al.On-chip determination of spermatozoa concentration using electrical impedance measurements [J].Lab on a Chip,2010,10(8):1018-1024.

[122] FLORIS A,STAAL S,LENK S,et al.A prefilled,ready-to-use electrophoresis based lab-on-a-chip device for monitoring lithium in blood [J].Lab on a Chip,2010,10(14):1799-1806.

[123] HIRAMA H,SATOH T,SUGIURA S,et al.Glass-based organ-on-a-chip device for restricting small molecular absorption [J].Journal of Bioscience and Bioengineering,2019,127(5):641-646.

[124] PERRONE E,CESARIA M,ZIZZARI A,et al.Potential of CO2-laser processing of quartz for fast prototyping of microfluidic reactors and templates for 3D cell assembly over large scale [J].Materials Today Bio,2021,12:100163.

[125] CHEN Q,LI G,JIN Q H,et al.A rapid and low-cost procedure for fabrication of glass microfluidic devices [J].Journal of Microelectromechanical Systems,2007,16(5):1193-1200.

[126] WANG C W,YANG L,ZHANG C C,et al.Multi-layered skyscraper microchips fabricated by hybrid “all-in-one” femtosecond laser processing [J].Microsystems & Nanoengineering,2019,5:17.

基本信息:

DOI:10.13250/j.cnki.wndz.25040103

中图分类号:TN405

引用信息:

[1]刘丹,乌李瑛,田苗,等.玻璃通孔成型工艺及应用的研究进展[J].微纳电子技术,2025,62(04):55-75.DOI:10.13250/j.cnki.wndz.25040103.

基金信息:

国家自然科学基金重点项目(62335014); 国家科技部“十四五”重点研发计划(2023YFC2413001); 上海市科技创新行动计划(22501100800); 上海交通大学决策咨询重点课题实验技术专项(JCZXSJA2023-05)

投稿时间:

2024-10-25

投稿日期(年):

2024

修回时间:

2024-11-15

终审时间:

2024-11-15

终审日期(年):

2024

审稿周期(年):

1

发布时间:

2025-02-27

出版时间:

2025-02-27

网络发布时间:

2025-02-27

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