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氧化铝陶瓷多层基板的平面度作为关键性能指标，直接影响着其在精密仪器、电子器件等领域的应用效果。由于芯片、金属零件封装技术可靠性及气密性要求不断提高，氧化铝陶瓷多层基板平面度亟需提高。影响多层基板平面度的因素较多，分析了不同浆料型号、层压压力、层压温度、层压时间对基板平面度的影响。研究结果表明，通过选用与氧化铝陶瓷收缩系数匹配性高的金属化浆料可有效改善氧化铝陶瓷多层基板的平面度。同时调整层压压力、层压温度和层压时间也能有效改善陶瓷平面度，其中层压压力对陶瓷平面度的影响较大。将层压压力调整至2 500～3 500 psi(1 psi=6 894.76 Pa)时，氧化铝陶瓷多层基板平面度得到很大改善，平面度可由原来的0.08～0.10 mm改善至0.04～0.05 mm。这一研究结果可为氧化铝陶瓷多层基板平面度控制提供参考。
Abstract：As a key performance index, the flatness of alumina ceramic multilayer substrate directly affects its application effect in fields such as precision instruments and electronic devices. Due to the continuous improvement of the reliability and airtightness requirements of chip and metal part packaging technologies, the flatness of alumina ceramic multilayer substrates urgently needs to be enhanced. There are many factors affecting the flatness of multilayer substrates. The influences of different paste types, lamination pressure, lamination temperature and lamination time on the flatness of the substrate were analyzed. The research results indicate that the use of metallization paste with high compatibility with the shrinkage coefficient of alumina ceramics can effectively improve the flatness of multilayer alumina ceramic substrates. As the same time, adjusting the lamination pressure, lamination temperature and lamination time can also effectively improve the flatness of the ceramic, and the laminating pressure has a greater influence on the flatness of the ceramic. When the lamination pressure is adjusted to 2 500-3 500 psi(1 psi=6 894.76 Pa), the flatness of the alumina ceramic muitilayer substrate is greatly improved, which can be improved from the original 0.08-0.10 mm to 0.04-0.05 mm. This study results can provide a reference for the flatness control of alumina ceramic multilayer substrate.
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基本信息:
DOI：10.13250/j.cnki.wndz.25080005
中图分类号:TN05
引用信息:
[1]张丹,淦作腾,李佳敏,等.氧化铝陶瓷多层基板平面度改进工艺研究[J].微纳电子技术,2025,62(08):37-42.DOI:10.13250/j.cnki.wndz.25080005.
2025-08-14
2025-08-14