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2026, 02, v.63 7-46
人工智能大语言模型、具身智能和AI芯片的新进展
基金项目(Foundation):
邮箱(Email):
DOI: 10.13250/j.cnki.wndz.26020101
摘要:

以ChatGPT和DeepSeek为代表的大语言模型(LLM)、具身智能和人工智能(AI)芯片的新发展标志人工智能在向“通用人工智能”发展目标又有了新的进步。综述了人工智能大语言模型、具身智能和AI芯片的最新进展和发展趋势。在人工智能大语言模型领域,包含DeepSeek LLM“现象级”崛起与GPT-5的发布、性能改进、安全性提高和深度应用等方面的新进展和发展趋势。在具身智能领域,包含基本概念和发展远景、框架和算法、具身智能加大语言模型、具身智能在人机交互、环境与伦理和具身智能结合LLM的应用创新等方面的新进展和发展趋势。在AI芯片和量子神经网络领域,包含数字AI芯片、原子级环栅(GAA)新架构工艺、模拟AI芯片、光子神经网络与光子AI芯片以及量子神经网络与应用创新等方面的新进展和发展趋势。

Abstract:

The new developments of large language models(LLMs) represented by ChatGPT and DeepSeek, embodied intelligence and artificial intelligence(AI) chips mark new progress towards the goal of “general artificial intelligence”. The latest progresses and development trends of large language models, embodied intelligence and AI chips in artificial intelligence are reviewed. In the field of large language models in artificial intelligence, there are new progresses and development trends including the “phenomenal” rise of DeepSeek LLM, the release of GPT-5, performance improvement, security enhancement and deep application. In the field of embodied intelligence, there are new progresses and development trends including basic concepts and development prospects, frameworks and algorithms, embodied intelligence combined with large language models, the application of embodied intelligence in human-computer interaction, environment and ethics, and the combination of embodied intelligence and LLM. In the field of AI chips and quantum neural networks, there are new progresses and development trends including digital AI chips, atomic-level gate-all-around(GAA)new architecture process, analog AI chips, photonic neural networks and photonic AI chips, quantum neural networks and application innovations.

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基本信息:

DOI:10.13250/j.cnki.wndz.26020101

中图分类号:TN40;TP18

引用信息:

[1]赵正平.人工智能大语言模型、具身智能和AI芯片的新进展[J].微纳电子技术,2026,63(02):7-46.DOI:10.13250/j.cnki.wndz.26020101.

发布时间:

2026-02-05

出版时间:

2026-02-05

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