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阐述了半导体制程用紫外(UV)减粘膜的结构及其在UV辐照前后粘着力骤变的反应机理,介绍了UV减粘膜的两种典型分类及晶圆背部研磨膜和切割膜的应用过程。通过综合分析古河电气工业株式会社、琳得科株式会社、狮力昂株式会社、积水化学工业株式会社、住友电木株式会社和综研化学株式会社等国外企业相关资料,梳理了各公司代表性产品及技术特点,可为UV减粘膜国产化替代提供一些思路和方向。归纳分析了国内企业在相关领域的产品专利,根据分析结果,国产UV减粘膜目前逐渐形成了具备耐高温、耐水冲击、耐可见光、抗静电以及可长期储存等特点的系列化产品。在半导体行业全产业链国产化进程推进过程中,国产UV减粘膜行业将会获得难得的发展机遇。
Abstract：The structure of ultraviolet(UV)-curable adhesive tape used in semiconductor processes and the reaction mechanism of sudden changes in adhesion before and after UV irradiation are elaborated. Two typical classifications of UV-curable adhesive tapes and the application process of wafer back grinding tape and dicing tape are introduced. By comprehensively analyzing the information of foreign companies such as Furukawa Electric, Lintec, Sliontec, Sekisui Chemical, Sumitomo Bakelite, and Soken Chemical, representative products and technical characteristics of each company are sorted out, providing some ideas and directions for domestic substitution. The patents of domestic enterprises in related fields are also analyzed. The domestically produced UV-curable adhesive tapes have gradually formed a series of products with characteristics such as high temperature resistance, water impact resistance, visible light resistance, anti-static, and long-term storage. In the process of promoting the localization of the entire industry chain in the semiconductor industry, the domestic UV-curable adhesive tape industry would gain valuable development opportunities.
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基本信息:
DOI：10.13250/j.cnki.wndz.26030104
中图分类号:TN305
引用信息:
[1]张宁,刘智昊,项奎.半导体制程用UV减粘膜综述[J].微纳电子技术,2026,63(03):64-71.DOI:10.13250/j.cnki.wndz.26030104.