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通过实验探究了在抛光液中加入羟丙基甲基纤维素(HPMC)和聚乙烯吡咯烷酮(PVP)两种水溶性聚合物对多晶硅表面的影响机理。HPMC的加入在多晶硅表面形成氢键，并形成一层保护层，改变多晶硅表面的润湿性，减少抛光液中碱性物质和多晶硅的化学反应，减少磨料与多晶硅表面/抛光垫的直接接触，减小了摩擦。加入的PVP与SiO2颗粒之间通过氢键吸附形成软磨料，提高了抛光液的分散性，减少了SiO2颗粒与多晶硅表面/抛光垫的摩擦。两种水溶性聚合物的协同作用，使得表面缺陷数量减少了94.5%,粗糙度降低至0.2 nm,提高了多晶硅表面质量。
Abstract：The influence mechanisms of the adding of two water-soluble polymers of hydroxypropyl methyl cellulose(HPMC) and polyvinylpyrrolidone(PVP) in the slurry on polysilicon surface were explored by experiments. The addition of HPMC forms hydrogen bonds on the polysilicon surface, HPMC adsorbed on the polysilicon surface to form a protective layer, modifies the surface wettability of polysilicon, reduces chemical reactions between alkaline substances in the slurry and polysilicon, minimizes direct contact between abrasives and polysilicon surface/polishing pad, and decreases friction. The added PVP and SiO2 particles are adsorbed by hydrogen bonds to form soft abrasive, which improves the dispersion of the slurry and reduces the friction between SiO2 particles and polysilicon surface/polishing pad. The synergistic effect of two water-soluble polymers reduces surface defect number by 94.5% and surface roughness to 0.2 nm, improving the surface quality of polysilicon
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基本信息:
DOI：10.13250/j.cnki.wndz.25040203
中图分类号:TN405
引用信息:
[1]张潇,周建伟,杨云点,等.水溶性聚合物提高多晶硅CMP表面质量的机理[J].微纳电子技术,2025,62(04):105-113.DOI:10.13250/j.cnki.wndz.25040203.
基金信息:
国家自然科学基金(62104087); 中国博士后基金(2024M751207); 河北工业大学创新研究院(石家庄)石家庄市科技合作专项基金资助(SJZZXB23003)
2025-04-15
2025-04-15