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采用商用有限元软件ABAQUS建立了单晶硅纳米压痕过程的2D轴对称模型,通过分析模拟得到载荷-位移曲线,讨论了压头尖端半径、压头与样品间的摩擦系数对压痕过程的影响规律。为了验证模拟结果的有效性,用美国Hysitron公司的Triboindenter纳米压痕仪进行了实验。由仿真结果可知,在固定压深的条件下,增大压头尖端半径,所需施加的载荷增加,弹性回复程度增加。而摩擦系数的改变对压痕过程影响不大,可以在模拟中忽略不计。对比仿真曲线和实验曲线,实验曲线在卸载段55nm处出现了一明显拐点,使得其弹性回复程度远大于模拟的结果。这是由于高压诱导的相变导致了单晶硅纳米压痕过程中出现了复杂的本构关系,而有限元软件中还没有如此复杂的本构关系模型。
Abstract：2D axisymmetric finite element model(FEM)was established for monocrystal silicon nanoindentation process with commercial finite element software package ABAQUS.The effect of the indenter tip radius and the friction coefficient between the nano-indenter and sample material on the nanoindentation process were discussed by analyzing the load-displacement curves from simulation.The experiments were made with Triboindenter of Hysitron,Inc.to verify the effectiveness of simulation results.For a given indentation depth,the applied load and elastic recovery increases with a tip radius increasing.The change of friction coefficient influences quite little on indentation process,which is ignored during the simulation.Comparing the simulation and experiment curves,an obvious elbow is discovered in experimental curves,because of phase transformation induced by high pressure,which causes complex constitutive relations during nanoindentation for which FEM hasn't this model.
[1]张泰华.微/纳米力学测试技术及其应用[M].北京:机械工业出版社,2004.
[2]苏才均,吴昊,郭占社,等.微构件材料力学性能测试方法[J].实验力学,2005,20(3):441-447.
[3]OLI VER W C,PHARR G M.An i mproved technique fordetermining hardness and elastic modulus using load and dis-placement sensingindentation experi ments[J].J Mater Res,1992,7(6):1546-1583.
[4]李敏,梁乃刚,张泰华,等.纳米压痕过程的三维有限元数值试验研究[J].力学学报,2003,35(3):257-264.
[5]张健.不同加载方式下类金刚石膜的变形行为及数值模拟研究[D].哈尔滨:哈尔滨工业大学,2006.
[6]刘扬.基于纳米压痕技术和有限元仿真的材料塑性性能分析[D].武汉:武汉理工大学,2003.
[7]YOUN S W,KANG C G.FEA study on nanodeformationbehaviors of amorphous silicon and borosilicate considering tipgeometry for pit array fabrication[J].Materials Science andEngineering:A,2005,390(1-2):233-239.
[8]RUFFELL S,BRADBYJ E,FUJISAWA N,et al.Identi-fication of nanoindentation-induced phase changes in silicon byin situ electrical characterization[J].Journal of AppliedPhysics,2007,101(8):083531-1-083531-7.
[9]HEBBACHE M.Nanoindentation:hardness and phase tran-sition in silicon[J].Materials Science and Engineering:A,2004,387-389:743-748.
[10]RAO R,BRADBYJ E,RUFFELL S,et al.Nanoindenta-tion induced phase transformation in crystalline silicon andrelaxed amorphous silicon[J].Microelectronics Journal,2007,38(6-7):722-726.
[11]LI N Y H,CHEN T C,YANG P F,et al.Atomic-levelsi mulations of nanoindentation-induced phase transformationin mono-crystalline silicon[J].Applied Surface Science,2007,254(5):1415-1422.
基本信息:
DOI：10.13250/j.cnki.wndz.2009.02.003
中图分类号:TB383.1
引用信息:
[1]陈樟,苏伟,万敏.单晶硅纳米压痕过程的有限元模拟与实验验证[J].微纳电子技术,2009,46(02):104-107.DOI:10.13250/j.cnki.wndz.2009.02.003.
2009-02-15
2009-02-15