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高温共烧陶瓷(HTCC)封装技术在电子元器件封装领域起着举足轻重的作用，该技术的成熟应用，依赖于高质量粉体制备技术和多层共烧技术的突破及稳定生产。近年来，在这两个传统工艺上，仍然出现了工艺的进步与革新。另外，高温共烧陶瓷在生产工艺、结构设计、材料创新方面也存在突破，包括：增材制造技术实现孔径9μm通孔与曲面转接板，微流道嵌入式设计提升散热效率，以及厚膜光刻工艺可以制备15μm线宽精细线条。分析表明，高温共烧陶瓷封装技术正通过新工艺、新结构及新材料向高功率密度、高精度方向演进，为攻克关键技术难题、推动行业发展提供技术路径。
Abstract：High-temperature co-fired ceramic(HTCC) packaging technology plays a pivotal role in the field of electronic component encapsulation. The mature application of this technology relies on advancements and consistent production in both high-quality powder preparation techniques and multilayer co-firing technology. In recent years, progress and innovations have continued to emerge in these two traditional processes. Furthermore, there are breakthroughs in the production processes, structural design and material innovation of HTCC, including additive manufacturing technology which enabled vias with 9 μm aperture and curved interposers, embedded microchannel designs which enhanced thermal dissipation efficiency, and thick-film photolithography technology which is capable of producing fine lines with the line width of 15 μm. Analysis indicates that HTCC packaging technology is evolving towards high power density and high precision through the new processes, the novel structures and the new materials. This evolution provides the technical pathway to overcome critical technological difficulty and drive industry development.
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基本信息:
DOI：10.13250/j.cnki.wndz.25080001
中图分类号:TN405
引用信息:
[1]王东生,任才华,张炳渠.高温共烧陶瓷的技术现状及新进展[J].微纳电子技术,2025,62(08):9-17.DOI:10.13250/j.cnki.wndz.25080001.